Services

Everything you need between schematic and shipment.

Full-service PCB design, simulation, library management, and turnkey manufacturing — under one roof, with a single point of accountability.

01 — PCB Layout Design

Layout that manufactures the first time.

From 2-layer prototypes to 24+ layer HDI high-speed beasts. We design boards that are routable, manufacturable, and testable — not just pretty in the CAD tool.

What's included

Schematic review & design constraint capture
Stack-up definition with fab-specific impedance
Component placement & partitioning
Constraint-driven routing
Power & ground plane design
DRC, DFM, and DFA sign-off
Manufacturing & assembly data packages

Layout Process

Our layout process, start to finish.

01 / 07

STEP 01

Schematic Review & Constraints

We start by understanding your design — not just the netlist. Topology, timing, power budgets, mechanical constraints, and compliance targets go in up front.

Netlist & schematic sanity check
High-speed net classing
Constraint manager rules set
Mechanical & thermal envelope locked

STEP 02

Stack-up Definition

The stack-up determines everything — impedance, crosstalk, power delivery, and manufacturability. We define it against the target fab's materials before placement begins.

Impedance targets per net class
Dielectric and copper thickness
Fab-specific material selection
Sequential lamination planning

STEP 03

Component Placement

Placement decides routability. We partition by function, protect sensitive analog, and keep high-speed buses short with a clear return-path strategy.

Functional block partitioning
Decoupling & bypass strategy
Thermal zoning
Mechanical & connector alignment

STEP 04

Constraint-Driven Routing

Every trace routed against explicit rules — impedance, length matching, skew, spacing, via counts. Nothing by accident.

Differential pairs with controlled skew
Length-matched DDR byte lanes
Controlled impedance to fab spec
Clean return paths, no split planes

STEP 05

Power & Ground Planes

Solid reference planes are the foundation of signal and power integrity. We keep them intact, manage splits, and ensure clean return current paths.

Unbroken ground planes under HS nets
Power island management
Via stitching for shielding
Plane-pair impedance for PDN

STEP 06

DRC / DFM / DFA Sign-off

Design rule, manufacturing, and assembly checks — from the CAD tool and from independent fab-rule decks. Issues caught in layout, not in the fab.

Electrical DRC clean
DFM against fab capability matrix
DFA for pick-and-place
Testability & test-point coverage

STEP 07

Manufacturing Data Package

A complete, documented package your fab and EMS can quote and build from without questions. Gerbers, ODB++, IPC-2581, drill, BOM, assembly drawings.

Gerber X2 + ODB++ + IPC-2581
NC drill + rout files
IPC-2221 stack-up document
BOM + pick-and-place + assembly dwg

Typical deliverables

Pre-layout SI analysis & topology recommendations
Post-layout signal integrity verification
Power integrity / PDN impedance analysis
Thermal simulation (board & component level)
Crosstalk, reflection, and eye diagram reports
Documented results & design recommendations

02 — Signal & Power Integrity

Margin you can measure.

For DDR4/5, PCIe Gen 4/5, 100/400GbE, USB 3.2/4, and SerDes above 25Gbps — spec sheets aren't enough. We simulate, verify, and document.

03 — Library Creation & Management

A library is a weapon.

Bad footprints kill boards. We build IPC-7351 compliant footprints, schematic symbols, and 3D STEP models against a defined rule set — then we maintain them.

Cadence Allegro, Altium Designer, Mentor Xpedition, PADS. Migrations between platforms. Centralized, version-controlled libraries that outlast individual designs.

Library services

IPC-7351 compliant footprint creation
Schematic symbol creation & standardization
3D STEP model generation
Datasheet-driven validation
Cross-tool library migration
Ongoing maintenance & rule enforcement

Manufacturing & Assembly

PCB fabrication — prototype to production volume
SMT, through-hole, and mixed-technology assembly
BGA rework & fine-pitch placement
Conformal coating & potting
Functional testing & AOI inspection
Global logistics & direct-to-customer delivery

04 — Turnkey Manufacturing

One partner, working board at the end.

You send us a schematic. We return working, tested, boxed boards. Prototype or production. Vetted fabs in Europe, the US, and Asia. Competitive pricing, aggressive lead times.

Assembled turnkey PCB with heatsinks and SMD components

Manufacturing Process

Inside the manufacturing stack.

01 / 07

FABRICATION 01

Multilayer Buildup

Rigid multilayer PCBs — from 2 layers to 24+ layer HDI with through-holes, blind, buried, and stacked microvias. Every stack engineered for impedance and manufacturability.

FR-4, high-Tg, Megtron, Rogers
Through-hole, blind, buried, microvia
Sequential lamination for HDI
Up to 24+ layers

FABRICATION 02

Lamination · Drill · Plate · Etch

The fundamental rigid PCB process — inner layers imaged and etched, pressed under heat and pressure, drilled, and plated through before outer-layer patterning.

Lamination under controlled T & P
Mechanical & laser drilling
Copper electroplating of holes
Photoresist imaging & etch

FABRICATION 03

Flex PCB

Polyimide-based flexible circuits for wearables, camera modules, folding displays, and dynamic-bend applications. Thin, light, and able to follow 3D geometry.

1–4 layer flex constructions
Rolled-annealed copper for bend life
Polyimide coverlay protection
Stiffeners for connectorized regions

FABRICATION 04

Rigid-Flex

Hybrid constructions combining rigid FR-4 sections with flexible polyimide bridges — one continuous board, no connectors, higher reliability, 3D form-fit.

Eliminates internal cables & connectors
Lower impedance discontinuity
Form-fits 3D enclosures
Aerospace, medical, wearable

FABRICATION 05

Surface Finish & Solder Mask

Final surface treatment determines solderability, shelf life, and contact reliability. We specify the right finish for each application — ENIG, HASL, OSP, or hard gold.

ENIG for fine-pitch BGA
Lead-free HASL for cost
OSP for short shelf life
Hard gold for edge connectors

ASSEMBLY 06

SMT Assembly

Solder-paste print, pick-and-place, multi-zone reflow — from 01005 passives to 0.4mm-pitch BGA. Nitrogen atmosphere for oxidation-sensitive joints.

Laser-cut stencils 100μm
Fine-pitch & BGA placement
Multi-zone reflow profiles
Selective soldering for through-hole

ASSEMBLY 07

AOI · X-ray · Functional Test

Every board inspected optically and electrically. BGA and QFN joints verified by X-ray. Functional test against your test specification before shipment.

3D AOI front + back
X-ray for hidden solder joints
In-circuit test (ICT)
Functional test to customer spec

Additional Services

Specialized support when you need it.

Rapid Prototyping

Quick-turn layout for time-critical iterations. Same-day starts. Short revision cycles.

Design Consultancy

Pre-design reviews, stack-up planning, constraint strategy, DFM feedback before layout begins.

Format Migration

Allegro ↔ Altium ↔ Xpedition ↔ PADS. Faithful conversion of schematics, libraries, and PCB databases.

Design for Manufacture

Independent DFM, DFA, and DFT reviews on designs already in progress — catch issues before the fab does.

Stack-up & Impedance

Board stack-up definition, controlled-impedance calculation, fab-specific trace geometry engineering.

Legacy Board Support

Revitalizing older designs — PCAD 2006, Boardstation, old Allegro revisions. Keep mature products in production.

Not sure which service you need?

Send us your schematic, your constraints, or just your problem statement. We'll tell you exactly what the job requires.

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